Embedded dual-port DRAM process

ABSTRACT

A new method to form DRAM cells in an integrated circuit device is achieved. The method comprises providing a substrate. A plurality of STI regions is formed in the substrate. The STI regions comprise trenches in the substrate. The trenches are filled with a first dielectric layer. All of the first dielectric layer is etched away from a first group of the STI regions to form open trenches while leaving the first dielectric layer in a second group of the STI regions. A second dielectric layer is formed overlying the substrate and lining the open trenches. A conductive layer is deposited overlying the second dielectric layer and completely filling the open trenches. The conductive layer is patterned to define DRAM transistor gates and to define DRAM capacitor top plates. Thereafter, ions are implanted into the substrate to form source and drain regions for the transistors.

BACKGROUND OF THE INVENTION

(1) Field of the Invention

The invention relates to an integrated circuit memory device, and, moreparticularly, to a method to form dual-port DRAM cells in an integratedcircuit device.

(2) Description of the Prior Art

Modern multimedia applications and personal computers require large RAMmemory systems with high throughput rates. In particular,three-dimensional graphics rendering and networking applications demanda combination of fast random access cycle times, low latency, and largememory sizes.

Referring now to FIG. 1, a plot is shown of typical RAM capacities(bits) versus random access cycle frequency (Hz). It is found that thelargest capacities can be formed in dynamic RAM (DRAM) technologies 10.However, these DRAM technologies are limited in their random accessoperating speed to the 10 MHz to 100 MHz range. It is also found thatthe fastest random cycle speeds are achieved using static RAM (SRAM)technology 18. However, the relatively large cell size of SRAM limitsthe capacity to about 1 Mbit. Further, it is found that a large numberof applications 14, such as multimedia and networking, would beoptimally served by a technology having an operating speed greater thanDRAM 10 and a size greater than SRAM 18. The teachings of the presentinvention are directed to filling this niche, especially for system onchip (SOC) architectures.

Referring now to FIG. 2, a typical DRAM cell construction is shown. Atypical DRAM cell comprises a storage capacitor 26 and an accesstransistor 22. Most prior art DRAM cells use a MOS transistor 22 as theaccess device. Many variations on storage capacitors 26 have beendescribed in the art. The source of the access transistor 22 is coupledto the storage capacitor 26. The drain of the access transistor 22 iscoupled to a bit line (BL) 34. The gate of the access transistor 22 iscoupled to a word line (WL) 30. The voltage, or charge, state of thestorage capacitor 26 determines the memory state of the cell. The accesstransistor 22 is turned ON or OFF by the WL 30 voltage. To write data tothe cell, the WL signal 30 is asserted to turn ON the access transistor22. The voltage on the BL signal is then coupled to the capacitor 26. Toread the cell, the access transistor 22 is again turned ON by the WLsignal 30. Charge on the capacitor 26 is then coupled onto the BL 34. Asense amplifier on the BL 34 is used to determine the capacitor voltageand, thereby, the memory value (0 or 1). In addition, the capacitor 26must be refreshed periodically to compensate for current leakage. Arefresh cycle performs a READ of the cell and then a WRITE of the cellto refresh the charge state of the capacitor.

The timing performance of this typical DRAM cell is shown. The BL signal34 performs in one of two states, ACTIVE and PRECHARGE. During theACTIVE state, the BL signal 34 is either forcing the WRITE voltage (highor low) to the cell or is conducting the READ charge from the cell.During the PRECHARGE state, the BL signal 34 is forced to a mid-level(between low and high) voltage that is most conducive to low leakagecurrent and to rapid WRITE/READ access. The BL signal 34 transitionsfrom the PRECHARGE state to the ACTIVE state in response to commands(CMD) such as READ or WRITE or REFRESH that are issued by the DRAMcontrol logic. The access cycle time is shown as the time betweenconsecutive accesses to the DRAM cell.

Referring now to FIG. 3, another prior art DRAM cell is shown. In thiscell, two access transistors 40 and 44 are used to control access to asingle storage capacitor 48. This configuration is called dual-portDRAM. The dual-port DRAM uses a first WL signal, WLa 60, to controlcoupling of a first BL signal, BLa 52, to the capacitor 48 via a firsttransistor 40. A second WL signal, WLb 64, is used to control couplingof a second BL signal, BLb 56, to the capacitor 48 via a secondtransistor 44. The key advantage of the dual-port DRAM cell is increasedspeed.

The timing diagram shows that the two access BL signals, BLa 52 and BLb56, work somewhat independently. When BLa is in the ACTIVE state inresponse to a CMD, BLb can be in PRECHARGE and visa versa. As a result,it is possible to access the storage capacitor 48 at twice the rate ofthe single-port DRAM cell of FIG. 2. While the access rate of thedual-port DRAM is doubled, the cell area is not doubled. The largestelement in a DRAM cell is the storage capacitor. While the dual-portDRAM doubles the number of access transistors 40 and 44, it onlyrequires a single storage capacitor 48. Because of the improvedperformance, the dual-port DRAM can offer significant advantages in themultimedia and networking regime of operation 14 described in FIG. 3. Inaddition, it is found that significant cost advantages can be achievedby integrating dual-port DRAM memory onto multimedia or networking chipsin SOC architectures. To facilitate this multiple technologyup-integration, the ability to form high performance logic, I/O, anddual-port DRAM onto a single integrated circuit device is necessary. Theintegration of these technologies is the focus of the present invention.

Several prior art inventions relate to DRAM cells and to shallow trenchisolation structures. U.S. Pat. No. 5,249,165 to Toda describes amultiple port memory device. U.S. Pat. No. 5,811,347 to Gardner et alteaches a method to form shallow trench isolation (STI). Nitrogen isincorporated into the trench liner oxide to thereby improve performanceand reduce active area loss. U.S. Pat. No. 6,323,106 B1 to Huang et aldescribes a method to form STI regions. A liner oxide is formed in thetrenches. A tilted angle, ion implantation of nitrogen is performed toform an oxynitride layer in the liner oxide of the trench sidewalls.U.S. Pat. No. 5,327,375 to Harari discloses a DRAM cell with a sidewallstorage capacitor. Multiple port DRAM cells and trench capacitors aredisclosed. Agata et al, in “An 8-ns Random Cycle Embedded RAM Macro WithDual-Port Interleaved DRAM Architecture (D²RAM), IEEE Journal ofSolid-State Circuits, Vol. 35, No. 11, November 2000, pp. 1668-1672,discloses a dual-port DRAM device with cells comprising one capacitorand two access transistors. Folded bitline architecture is described.

SUMMARY OF THE INVENTION

A principal object of the present invention is to provide an effectiveand very manufacturable method to form dual-port DRAM in an integratedcircuit device.

A further object of the present invention is to provide a method to formdual-port DRAM in a standard CMOS process while making minimal changesto that process.

A yet further object of the present invention is to provide a method toform dual-port DRAM cells having minimal cell area and optimal accessspeed.

A yet further object of the present invention is to provide a method toform dual-port DRAM using available shallow trench isolation (STI)trenches to form trench capacitors.

A yet further object of the present invention is to provide a dual-portDRAM cell having a small layout area and excellent performance.

A yet further object of the present invention is to provide dual-portDRAM capability in a system on chip (SOC) integrated circuit device.

In accordance with the objects of this invention, a method to form DRAMcells in an integrated circuit device is achieved. The method comprisesproviding a substrate. A plurality of STI regions is formed in thesubstrate. The STI regions comprise trenches in the substrate. Thetrenches are filled with a first dielectric layer. All of the firstdielectric layer is etched away from a first group of the STI regions toform open trenches while leaving the first dielectric layer in a secondgroup of the STI regions. A second dielectric layer is formed overlyingthe substrate and lining the open trenches. A conductive layer isdeposited overlying the oxide layer and completely filling the opentrenches. The conductive layer is patterned to define DRAM transistorgates and to define DRAM capacitor top plates. Thereafter, ions areimplanted into the substrate to form source and drain regions for thetransistors.

Also in accordance with the objects of this invention, an integratedcircuit device is achieved. The device comprises a plurality of MOSdevices. A plurality of STI regions in a substrate separates the MOSdevices. An array of DRAM cells each comprises a capacitor comprising atrench in the substrate. The trench is lined by a dielectric layer. Thetrench is filled by a conductive layer overlying the dielectric layer.The trench is etched at the same time as trenches for the STI regions.Access transistors having gate, drain, and source terminals areincluded. The gate terminals comprise the polysilicon layer.

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings forming a material part of thisdescription, there is shown:

FIG. 1 illustrates the relationship between RAM capacity and randomaccess frequency for different types of RAM devices.

FIG. 2 illustrates a prior art DRAM cell showing access timing.

FIG. 3 illustrates a prior art dual port, DRAM cell showing accesstiming.

FIGS. 4 through 19 illustrate a preferred embodiment of the presentinvention showing a method to form dual port, DRAM cells in anintegrated circuit device.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The preferred embodiments of the present invention disclose a method toform dual-port DRAM cells. The method integrates a unique dual-port DRAMfabrication into a standard CMOS process. It should be clear to thoseexperienced in the art that the present invention can be applied andextended without deviating from the scope of the present invention.

Referring now to FIGS. 4 through 19, the preferred embodiment of thepresent invention is illustrated. Many important features of the presentinvention are shown and discussed below. The preferred embodimentdiscloses a method to form dual-port DRAM cells in a standard CMOSprocess. Referring again particularly to FIG. 4, a substrate 100 isprovided. The substrate 100 preferably comprises a semiconductormaterial and, more preferably, comprises monocrystalline silicon. In aprocess sequence that is typical of widely practice CMOS technology, apad oxide layer 104 is formed on the substrate wafer 100. Typically,this pad oxide layer 104 is formed by thermal oxidation of the substrate100. Next, a nitride layer 108 is deposited overlying the pad oxidelayer 104. The nitride layer 108 serves as a masking layer during theprocesses used for defining active areas and shallow trench isolation(STI) regions. The pad oxide layer 104 improves adherence between thenitride layer 108 and the substrate 100. Preferably, the nitride layer108 comprises silicon nitride that is deposited using a chemical vapordeposition (CVD) process.

Trenches 112 and 116 are etched through the nitride layer 108, the padoxide layer 104, and into the substrate 100. Typically, a photoresistlayer, not shown, is deposited overlying the nitride layer 108. Thisphotoresist layer is then exposed to actinic light through a reticle.After development, the remaining photoresist layer forms a mask whichcovers parts of the nitride layer 108 while exposing parts of thenitride layer 108. An etching process is then performed. The exposednitride layer 108 is etched while the covered nitride layer 108 is notetched. After etching through the nitride layer 108, the pad oxide layer104 is etched through where exposed by the nitride layer 108. Finally,the substrate 100 is etched where exposed by the nitride layer 108 andthe pad oxide layer 104. For example, an anisotropic, dry etchingprocess may be used. Following the etching process, or perhaps followingthe etching of the nitride layer 108, the remaining photoresist layer isstripped.

The above-described process forms a plurality of trenches 112 and 116 inthe surface of substrate 100. In the present invention, the integratedcircuit device comprises at least two types of areas: DRAM area andnon-DRAM area. More preferably, the device comprises a CORE area, a DRAMarea, and an I/O area. The CORE area comprises the area of theintegrated circuit device where high density, small feature size, lowoperating voltage CMOS transistors are formed. In the DRAM area, thedual-port DRAM cells are formed. In the I/O area, the I/O pads andcircuits coupled directly to the pads are formed. Generally, the I/Oarea comprises devices formed with larger feature sizes and higheroperating voltages. The trenches 112 and 116 formed in the substrate 100are typical of those formed for shallow trench isolation (STI) regions.As will be described below, the trenches 112 in the CORE and I/O areaswill be used for STI regions, while the trenches 116 in the DRAM cellarea will be used for storage capacitors. The simultaneous formation ofthis plurality of trenches 112 and 116, where some trenches 112 are usedfor STI regions and some trenches 116 are used dual-port DRAMcapacitors, is a unique feature of the present invention.

Referring now to FIG. 5, a first dielectric layer 120 is formedoverlying the nitride layer 108 and filling the trenches 112 and 116.The first dielectric layer 120 preferably comprises silicon oxide thatis deposited by CVD. The first dielectric layer 120 is then planarizedto the top surface of the nitride layer 108 to form STI regions 120.Preferably, the planarization step comprises a chemical mechanicalpolish. Other planarization processes may be used. As an importantfeature, the nitride layer 108 is preferably not removed from thesubstrate 100 at this point.

Referring now to FIG. 6, a particularly important feature of the presentinvention is illustrated. The first dielectric layer 120 is selectivelyetched away from the trenches 116 where dual-port DRAM capacitors areplanned. Preferably, a crown mask layer 122 is first deposited overlyingthe nitride layer 108 and the STI regions 120. The crown mask layer 122is then patterned to expose the STI regions 116 in the DRAM cell areawhere storage capacitors, or crown capacitors, are planned. The trenchdielectric layer 120 is etched away where it is exposed by the crownmask 122. The presence of the nitride layer 108 reduces etching of thesubstrate 100 during the dielectric layer 120 etching step. Thiseliminates damage to the substrate 100 and results in a storagecapacitor with low leakage current. The crown mask layer 122 preferablycomprises a photoresist material that is patterned as described above.

Referring now to FIG. 7, important, but optional features of the presentinvention are disclosed. The crown masking layer 122 is removed. An ionimplantation 124 may then be performed. An inert ion species isimplanted 124 into the sidewalls of the open trenches 116 in the DRAMarea. The inert ion species is defined as a species that is not a dopant(donor or acceptor) for the substrate 100. For example, nitrogen (N₂)may be implanted into the sidewalls of the trenches. The presence of theinert species in the substrate material 100 of the sidewalls is found tosuppress the oxide growth rate of the sidewalls. Note that the siliconof the sidewalls of the trenches has a different crystal orientationthan the crystal orientation of the bottom of the trenches or of the topsurface of the wafer. For example, the wafer top surface and the bottomsurface of the trenches may be oriented in the <100> direction while thesidewalls are oriented in either the <110> or the <111> direction. Inthis case, the sidewalls would exhibit a higher oxide growth rate thanthe horizontal surfaces. It is advantageous to keep the sidewall oxidegrowth rate as low, as or lower than, the growth rate of the horizontalsurfaces. Implantion of the inert ion species will reduce the oxidegrowth rate on the sidewalls. During the subsequent process steps, thereduced oxide growth rate will enable a thinner oxide layer to be formedbetween the bottom plate and the top plate of the cell capacitor. Thisincreases the unit capacitance of the completed cell capacitor. Inaddition, the inert ion implantation 124 will improve the uniformity ofthe oxide.

As a second option, ions may be implanted 125 into the substrate in theopen trenches to optimize the threshold voltage of the cell plate. Inthis case, dopant ions, such as boron, phosphorous, or arsenic, are usedto create a doped region 128 in the substrate 100. The nitride layer 108forms a hard mask for either of the optional ion implantation steps 124and 125. Note that both the inert implant 124 and the threshold implant125 are performed without an additional masking step. Both implants 124and 125 are self-aligned such that the implantation is selective to onlythe open trenches 116 in the DRAM area.

Referring now to FIG. 8, as an important step in the preferredembodiment, the nitride layer 108 and the pad oxide layer 104 areremoved. Preferably, the nitride layer 108 and the pad oxide layer 104are etched away. During the pad oxide layer 104 etch, a top layer of thetrench dielectric layer 120 may be consumed. The substrate 100 isexposed.

Referring now to FIG. 9, ions may be implanted into the substrate 100 toform wells 136, 140, and 144. For example, n-type well regions (NW) maybe formed in the substrate 100 where the substrate is p-type. Further,separate implants 132 may be performed to form wells 136, 140, and 144having different concentrations-or depths for the I/O, CORE, and DRAMareas, respectively. Typically, a masking layer is defined for each typeof well that is implanted. In addition, a sacrificial oxide layer may begrown.

Referring now to FIG. 10, an important step in the preferred embodimentof the present invention is shown. A second dielectric layer will beformed overlying the substrate 100 and lining the open trenches 116. Inthe preferred embodiment, the second dielectric layer comprises threedifferent thicknesses for the three device areas of CORE, DRAM, and I/O.It should be understood that the second dielectric layer could be formedto a single thickness. As a first step in the preferred embodiment, afirst oxide layer 150 is formed overlying the substrate 100 and liningthe open trenches 116 of the DRAM area. It is possible for the firstoxide layer 150 to be used as the gate dielectric for the CORE CMOS, forthe I/O CMOS, and for the dual-port DRAM transistors and cellcapacitors. However, in the preferred embodiment, three different oxidethicknesses are formed for the CORE, I/O, and DRAM areas. Therefore, amethod to form three oxide thicknesses is illustrated. This first oxidelayer 150 preferably comprises silicon oxide that is grown by thermaloxidation. The first oxide layer preferably comprises a thickness ofbetween about 45 Angstroms and about 70 Angstroms.

Referring now to FIG. 11, the first oxide layer 150 is selectivelyremoved from the DRAM cell area. The first oxide layer 150 is etchedaway from the DRAM capacitor trenches 116 and the active area forforming the dual-port access transistors. A first oxide mask 154 ispreferably formed such that the DRAM cell areas are exposed. The firstoxide mask 154 may comprises a photoresist layer that is patterned asdescribed above.

Referring now to FIG. 12, a second oxide layer 160 is now formedoverlying the first oxide layer 150, the exposed substrate 100, and theopen DRAM capacitor trenches. For simplicity of illustration, the secondoxide layer 160 is included in the first oxide layer 150 for the COREand I/O areas. It is understood that the oxide layer 150 overlying theCORE and I/O areas is made yet thicker during the oxide growth.Preferably, the second oxide layer 160 is formed by thermal oxidation toa thickness of between about 24 Angstroms and about 30 Angstroms.

Referring now to FIG. 13, the combined thickness of the second oxidelayer 160 and the first oxide layer 150 is selectively removed from theCORE area. A second oxide mask 164 may be formed to allow for theselective etching away of the oxide from the CORE area substrate 100surface.

Referring now to FIG. 14, a third oxide layer 170 is formed overlyingthe exposed substrate 100 and the second oxide layer 160. The thirdoxide layer 170 is preferably formed by thermal oxidation to a thicknessof between about 16 Angstroms and about 24 Angstroms. The thickness ofthe third oxide layer 170 will be the thickness of the gate oxide 170for the CMOS devices formed in the CORE area. The combined thickness ofthe second oxide layer 160 and additional growth during the third oxidelayer oxidation will be the thickness of the gate oxide 160 for the DRAMcell devices. The combined thickness of the first oxide layer 150 andadditional growth during the second and third oxide layer oxidation willbe the thickness of the gate oxide layer 150 for the I/O devices. As canbe seen, the preferred method of the present invention allows threeoptimal oxide thicknesses to be formed. Typically, the CORE oxide 170will be the thinnest, the I/O oxide 150 will be the thickest, and theDRAM oxide 160 will be a mid-range thickness. This approach willfacilitate the formation of high speed CORE transistors, moderatespeed/low leakage DRAM devices, and high voltage I/O transistors.Alternatively, the method could be easily altered to produce two or onlyone oxide thickness over the areas by eliminating masking and etchingsteps. In the preferred embodiment, the second dielectric layer 150,160, and 170 comprises silicon oxide. Alternative dielectric materials,such as metal oxides or nitride-based materials, may be used.

Referring now to FIG. 15, an important feature of the present inventionis illustrated. A conductive layer 180 is deposited overlying the first,second, and third oxide layers 150, 160, and 170, also known as thesecond dielectric layer 150, 160, and 170. The conductive layer 180preferably comprises polysilicon and, more preferably, comprises dopedpolysilicon. Other materials, such as metal materials, may be used. Apolysilicon layer 180 is preferably deposited by CVD to a thickness ofbetween about 1,500 Angstroms and about 2,500 Angstroms.

Referring now to FIG. 16, the conductive layer 180 is patterned to formgates 210 of MOS devices in the CORE region, to form gates 214 of MOSdevices in the I/O region, to form gates 200 and 204 of accesstransistors in the DRAM region, and to form top plates 190 of cellcapacitors in the DRAM region. A gate masking layer 184 is used toselectively etch the conductive layer 180. For example, a photoresistlayer 184 is deposited overlying the conductive layer 180. Thephotoresist layer 184 is patterned by the method described above. Theexposed conductive layer 180 is then etched using, for example, a dryetch process as is well known in the art. The ability to form the MOStransistor gates 200, 204, 210, and 214, simultaneous with the DRAMcapacitor top plates 190 is a key feature of the present invention andenables a simple integration of the DRAM cells into a CMOS device.

Referring now to FIG. 17, as an optional feature, ions are implanted 224into the substrate 100 to form lightly doped drain (LDD) regions 230self-aligned to the gates 200, 204, 210, and 214, and to the capacitortop plates 190. The formation of LDD regions 230 self-aligned to MOSgates is a well-known method to reduce short channel effects in MOSdevices.

Referring now to FIG. 18, ions are implanted 245 into the substrate 100to form source regions 250 b and drain regions 250 a for the MOStransistors 200, 204, 210, and 214. In the preferred embodiment, spacers240 are first formed on the sidewalls of the conductive layer 180. Thespacers 240 comprise a dielectric material that is deposited and thenanisotropically etched back. Typically, the source regions 250 b anddrain regions 250 a are deeper and more heavily doped that the LDDregions 230.

Referring now to FIG. 19, an interlevel dielectric layer 260 isdeposited overlying the MOS gates 210, 214, 200, and 204, the capacitortop plates 190, and the substrate 100. The interlevel dielectric layer260 is then patterned to form contact openings to the underlying drainregions 250 and to the conductive layer 180. A metal layer 270 isdeposited overlying the interlevel dielectric layer 260 and filling thecontact openings. The metal layer 270 is patterned to form connectivelines. The drains 250 of the access transistors 200 and 204 are coupledto bit line signals such as BLa and BLb. Note that the source sideregions 250 b will connect to a plate inversion layer 253 that is formedwhen the top plate 180 is biased. In this way, the bottom plate of thecapacitor is coupled to the source regions 250 b without a contactopening or metal routing.

The completed integrated circuit may now be described. The devicecomprises a plurality of MOS devices 210 and 214. A plurality of STIregions 120 in a substrate 100 separates the MOS devices 210 and 214. Anarray of DRAM cells each comprises a capacitor 190 comprising a trench116 in the substrate 100. The trench 116 is lined by a second dielectriclayer 160. The trench 116 is filled by a conductive layer 180 overlyingthe oxide layer 160. The trench 116 is etched at the same time astrenches 112 for the STI regions 120. Access transistors 200 and 204having gate 180, drain 250, and source 250 terminals are included. Thegate terminals 200 and 204 comprise the conductive layer 180.

The advantages of the present invention may now be summarized. Aneffective and very manufacturable method to form dual-port DRAM in anintegrated circuit device is achieved. The method to form dual-port DRAMin a standard CMOS process requires minimal changes to that process. Thedual-port DRAM cells have minimal cell area and optimal access speed.The method to form dual-port DRAM uses available shallow trenchisolation (STI) trenches to form trench capacitors. A dual-port DRAMcell having a small layout area and excellent performance is achieved.Dual-port DRAM capability in a system on chip (SOC) integrated circuitdevice is achieved.

As shown in the preferred embodiments, the novel method and device ofthe present invention provides an effective and manufacturablealternative to the prior art.

While the invention has been particularly shown and described withreference to the preferred embodiments thereof, it will be understood bythose skilled in the art that various changes in form and details may bemade without departing from the spirit and scope of the invention.

What is claimed is:
 1. A method to form DRAM cells in an integratedcircuit device, said method comprising: providing a substrate; forming aplurality of STI regions in said substrate wherein said STI regionscomprise trenches in said substrate and wherein said trenches are filledwith a dielectric layer; etching away all of said first dielectric layerfrom a first group of said STI regions to form open trenches whileleaving said first dielectric layer in a second group of said STIregions; forming second dielectric layer overlying said substrate andlining said open trenches; depositing a conductive layer overlying saidsecond dielectric layer and completely filling said open trenches;patterning said conductive layer to define DRAM transistor gates and todefine DRAM capacitor top plates; and thereafter implanting ions intosaid substrate to form source and drain regions for said transistors. 2.The method according to claim 1 further comprising: forming a siliconnitride layer overlying said substrate prior to said step of forming aplurality of STI regions in said substrate; and removing said siliconnitride layer prior to said step of forming a second dielectric layeroverlying said substrate and lining said open trenches.
 3. The methodaccording to claim 1 wherein said step of etching away all of said firstdielectric layer from a first group of said STI regions to form opentrenches while leaving said first dielectric layer in a second group ofsaid STI regions comprises: depositing a masking layer overlying saidsubstrate and said plurality of STI regions; patterning said maskinglayer to expose said first group of said STI regions while covering saidsecond group of said STI regions; and etching away said first dielectriclayer from said first group of STI regions.
 4. The method according toclaim 1 further comprising implanting inert ions into said open trenchesto suppress oxide growth.
 5. The method according to claim 4 whereinsaid inert ions comprise nitrogen.
 6. The method according to claim 1further comprising implanting dopant ions into said open trenches toadjust the voltage threshold of said DRAM cells.
 7. The method accordingto claim 1 further comprising implanting ions into said substrate toform well regions underlying said DRAM cells after said step of etchingaway all of said first dielectric layer from a first group of said STIregions to form open trenches while leaving said first dielectric layerin a second group of said STI regions and before said step of forming asecond dielectric layer overlying said substrate and lining said opentrenches.
 8. The method according to claim 1 further comprising:implanting ions into said substrate to form lightly doped source anddrain regions for said DRAM cell transistors after said step ofpatterning said conductive layer to define DRAM transistor gates and todefine DRAM capacitor top plates; and thereafter forming spacers onsidewalls of said transistor gates prior to said step of implanting ionsinto said substrate to form source and drain regions for saidtransistors.
 9. The method according to claim 1 wherein said substratecomprises a core area, an I/O area, and a DRAM area and wherein saidstep of forming a second dielectric layer overlying said substrate andlining said open trenches further comprises: forming a first oxide layeroverlying said substrate and lining said open trenches; removing saidfirst oxide layer only from said DRAM area; forming a second oxide layeroverlying said substrate, said first oxide layer, and lining said opentrenches; removing said first oxide layer and said second oxide layeronly from said core area; and forming a third oxide layer overlying saidsubstrate, said first oxide layer, said second oxide layer, and liningsaid trenches.
 10. The method according to claim 1 wherein said seconddielectric layer comprises silicon oxide.
 11. The method according toclaim 1 wherein said conductive layer comprises polysilicon.
 12. Amethod to form DRAM cells in an integrated circuit device, said methodcomprising: providing a substrate; forming a silicon nitride layeroverlying said substrate; forming a plurality of STI regions in saidsubstrate wherein said STI regions comprise trenches in said substrateand wherein said trenches are filled with a dielectric layer; etchingaway all of said dielectric layer from a first group of said STI regionsto form open trenches while leaving said dielectric layer in a secondgroup of said STI regions; implanting inert ions into said open trenchesto suppress oxide growth; thereafter removing said silicon nitridelayer; forming an oxide layer overlying said substrate and lining saidopen trenches; depositing a polysilicon layer overlying said oxide layerand completely filling said open trenches; patterning said polysiliconlayer to define DRAM transistor gates and to define DRAM capacitor topplates; and thereafter implanting ions into said substrate to formsource and drain regions for said transistors.
 13. The method accordingto claim 12 wherein said step of etching away all of said dielectriclayer from a first group of said STI regions to form open trenches whileleaving said dielectric layer in a second group of said STI regionscomprises: depositing a masking layer overlying said substrate and saidplurality of STI regions; patterning said masking layer to expose saidfirst group of said STI regions while covering said second group of saidSTI regions; and etching away said dielectric layer from said firstgroup of STI regions.
 14. The method according to claim 12 wherein saidinert ions comprise nitrogen.
 15. The method according to claim 12further comprising implanting dopant ions into said open trenches toadjust the voltage threshold.
 16. The method according to claim 12further comprising implanting ions into said substrate to form wellregions underlying said DRAM cells after said step of etching away allof said dielectric layer from a first group of said STI regions to formopen trenches while leaving said dielectric layer in a second group ofsaid STI regions and before said step of forming an oxide layeroverlying said substrate and lining said open trenches.
 17. The methodaccording to claim 12 further comprising: implanting ions into saidsubstrate to form lightly doped source and drain regions for said DRAMcell transistors after said step of patterning said polysilicon layer todefine DRAM transistor gates and to define DRAM capacitor top plates;and thereafter forming spacers on sidewalls of said transistor gatesprior to said step of implanting ions into said substrate to form sourceand drain regions for said transistors.
 18. The method according toclaim 12 wherein said substrate comprises a core area, an I/O area, anda DRAM area and wherein said step of forming an oxide layer overlyingsaid substrate and lining said open trenches further comprises: forminga first oxide layer overlying said substrate and lining said opentrenches; removing said first oxide layer only from said DRAM area;forming a second oxide layer overlying said substrate, said first oxidelayer, and lining said open trenches; removing said first oxide layerand said second oxide layer only from said core area; and forming athird oxide layer overlying said substrate, said first oxide layer, saidsecond oxide layer, and lining said trenches.